"Contact Area Analysis by FEM with Plating Layer for Electrical Contact."

Kaori Shimizu et al. (2009)

> Home

Details and statistics

DOI: 10.1587/TRANSELE.E92.C.1013

access: closed

type: Journal Article

metadata version: 2020-04-11

- view
  authority control:
- export record
  dblp key:
  - journals/ieicet/ShimizuSSH09
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/ieicet/ShimizuSSH09
Kaori Shimizu, Shigeki Shimada, Shigeru Sawada, Yasuhiro Hattori:
Contact Area Analysis by FEM with Plating Layer for Electrical Contact. IEICE Trans. Electron. 92-C(8): 1013-1019 (2009)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.