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"3D Inspection on Wafer Solder Bumps Using Binary Grating Projection in ..."
Shu Yuan, Dongping Tian, Yanxing Zeng (2006)
- Shu Yuan, Dongping Tian, Yanxing Zeng:
3D Inspection on Wafer Solder Bumps Using Binary Grating Projection in Integrated Circuit Manufacturing. IEICE Trans. Electron. 89-C(5): 602-607 (2006)
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