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"3D Inspection on Wafer Solder Bumps Using Binary Grating Projection in ..."

Shu Yuan, Dongping Tian, Yanxing Zeng (2006)

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DOI: 10.1093/IETELE/E89-C.5.602

access: closed

type: Journal Article

metadata version: 2020-04-11

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Shu Yuan, Dongping Tian, Yanxing Zeng:
3D Inspection on Wafer Solder Bumps Using Binary Grating Projection in Integrated Circuit Manufacturing. IEICE Trans. Electron. 89-C(5): 602-607 (2006)

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