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"Modelling and electro-hygrothermo-mechanical reliability analyses of ..."

K. Balaguru, K. Padmanabhan, S. Subeesh (2014)

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DOI: 10.1504/IJCAET.2014.063115

access: closed

type: Journal Article

metadata version: 2020-03-24

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K. Balaguru, K. Padmanabhan, S. Subeesh:
Modelling and electro-hygrothermo-mechanical reliability analyses of leadless dual IC packages. Int. J. Comput. Aided Eng. Technol. 6(3): 252-270 (2014)

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