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"Process design for transfer moulding of electronic packages using a ..."

K. W. Tong, C. K. Kwong, Ching-Yuen Chan (2005)

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DOI: 10.1080/09511920412331284771

access: closed

type: Journal Article

metadata version: 2020-05-11

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K. W. Tong, C. K. Kwong, Ching-Yuen Chan:
Process design for transfer moulding of electronic packages using a case-based reasoning approach with fuzzy regression adaptation. Int. J. Comput. Integr. Manuf. 18(1): 27-40 (2005)

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