"Finite element analysis on stress/strain in CBGA solder joint with ..."

Yang Ping, Caijun Shen (2009)

> Home

Details and statistics

DOI: 10.1504/IJMTM.2009.026393

access: closed

type: Journal Article

metadata version: 2020-06-04

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/ijmtm/PingS09
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/ijmtm/PingS09
Yang Ping, Caijun Shen:
Finite element analysis on stress/strain in CBGA solder joint with different substrates under thermal cycle. Int. J. Manuf. Technol. Manag. 18(3): 333-339 (2009)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.