"Improving ICs reliability with high speed thermal mapping."

Saverio Panarello et al. (2018)

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DOI: 10.1016/J.VLSI.2018.01.001

access: closed

type: Journal Article

metadata version: 2020-11-04

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Saverio Panarello, Claudia Triolo, F. Garesci, Salvatore Patanè, R. Denaro:
Improving ICs reliability with high speed thermal mapping. Integr. 63: 342-350 (2018)

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