"Thermal Modeling and Analysis of 3D ICS with Heat Dissipation Effect of ..."

Yinghao Feng et al. (2024)

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DOI: 10.1142/S0218126624503092

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type: Journal Article

metadata version: 2025-04-08

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Yinghao Feng, Gang Dong, Daihang Liu, Changle Zhi, Deguang Yang, Yang Wang, Zhangming Zhu, Yintang Yang:
Thermal Modeling and Analysis of 3D ICS with Heat Dissipation Effect of Power Distribution Networks. J. Circuits Syst. Comput. 33(17): 2450309:1-2450309:24 (2024)

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