"Integrated data envelopment analysis and neural network model for ..."

Chia-Yu Hsu (2014)

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DOI: 10.1007/S10845-013-0808-0

access: closed

type: Journal Article

metadata version: 2020-09-24

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Chia-Yu Hsu:
Integrated data envelopment analysis and neural network model for forecasting performance of wafer fabrication operations. J. Intell. Manuf. 25(5): 945-960 (2014)

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