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"Highly integrated three-dimensional MMIC technology applied to novel ..."

Tsuneo Tokumitsu et al. (1997)

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DOI: 10.1109/4.628736

access: closed

type: Journal Article

metadata version: 2022-07-07

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  - https://dblp.org/rec/journals/jssc/TokumitsuHYYNA97
Tsuneo Tokumitsu, Makoto Hirano, Kimiyoshi Yamasaki, Chikara Yamaguchi, Kenjiro Nishikawa, Masayoshi Aikawa:
Highly integrated three-dimensional MMIC technology applied to novel masterslice GaAs- and Si-MMICs. IEEE J. Solid State Circuits 32(9): 1334-1341 (1997)

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