"A Modular, Direct Time-of-Flight Depth Sensor in 45/65-nm 3-D-Stacked CMOS ..."

Augusto Ronchini Ximenes et al. (2019)

> Home

Details and statistics

DOI: 10.1109/JSSC.2019.2938412

access: open

type: Journal Article

metadata version: 2023-07-27

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/jssc/XimenesPLYYC19
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/jssc/XimenesPLYYC19
Augusto Ronchini Ximenes, Preethi Padmanabhan, Myung-Jae Lee, Yuichiro Yamashita, Dun-Nian Yaung, Edoardo Charbon:
A Modular, Direct Time-of-Flight Depth Sensor in 45/65-nm 3-D-Stacked CMOS Technology. IEEE J. Solid State Circuits 54(11): 3203-3214 (2019)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.