"Reliability analysis of PoP stacked solder joints under thermal cycling ..."

Chao Gao et al. (2025)

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DOI: 10.1016/J.MEJO.2025.106596

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type: Journal Article

metadata version: 2025-03-10

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Chao Gao, Chunyue Huang, Ying Liang, Gui Wang, Yongling Chen:
Reliability analysis of PoP stacked solder joints under thermal cycling load based on the optimal equivalent model. Microelectron. J. 158: 106596 (2025)

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