"Thermal challenges in MEMS applications: phase change phenomena and ..."

Liwei Lin (2003)

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DOI: 10.1016/S0026-2692(02)00186-6

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type: Journal Article

metadata version: 2023-11-12

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Liwei Lin:
Thermal challenges in MEMS applications: phase change phenomena and thermal bonding processes. Microelectron. J. 34(3): 179-185 (2003)

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