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"Through-silicon-via insertion for performance optimization in ..."

Libo Qian, Zhangming Zhu, Yintang Yang (2012)

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DOI: 10.1016/J.MEJO.2011.11.004

access: closed

type: Journal Article

metadata version: 2020-02-22

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Libo Qian, Zhangming Zhu, Yintang Yang:
Through-silicon-via insertion for performance optimization in three-dimensional integrated circuits. Microelectron. J. 43(2): 128-133 (2012)

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