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"Numerical investigation and experimental validation of residual stresses ..."

A. R. Rezaie Adli, Kaspar M. B. Jansen (2016)

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DOI: 10.1016/J.MICROREL.2016.03.015

access: closed

type: Journal Article

metadata version: 2020-02-22

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A. R. Rezaie Adli, Kaspar M. B. Jansen:
Numerical investigation and experimental validation of residual stresses building up in microelectronics packaging. Microelectron. Reliab. 62: 26-38 (2016)

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