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"Highlighting two integration technologies based on vias: Through silicon ..."
M. Balmont et al. (2018)
- M. Balmont, Isabelle Bord-Majek
, B. Poupard, Laurent Béchou, Yves Ousten:
Highlighting two integration technologies based on vias: Through silicon vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability. Microelectron. Reliab. 88-90: 1108-1112 (2018)
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