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"Die repackaging for failure analysis."

S. Barberan, E. Auvray (2005)

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DOI: 10.1016/J.MICROREL.2005.07.051

access: closed

type: Journal Article

metadata version: 2020-02-22

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S. Barberan, E. Auvray:
Die repackaging for failure analysis. Microelectron. Reliab. 45(9-11): 1576-1580 (2005)

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