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"Failures on DC-DC modules following a change of wire bonding material from ..."

Yannis Belfort et al. (2015)

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DOI: 10.1016/J.MICROREL.2015.07.032

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yannis Belfort, J.-M. Caignard, S. Keller, J.-P. Guerveno:
Failures on DC-DC modules following a change of wire bonding material from gold to copper. Microelectron. Reliab. 55(9-10): 2003-2006 (2015)

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