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"Reliability model for bridging failure of Pb-free ball grid array solder ..."

Tz-Cheng Chiu et al. (2010)

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DOI: 10.1016/J.MICROREL.2010.06.012

access: closed

type: Journal Article

metadata version: 2020-02-22

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Tz-Cheng Chiu, Jyun-Ji Lin, Hung-Chun Yang, Vikas Gupta:
Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive load. Microelectron. Reliab. 50(12): 2037-2050 (2010)

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