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"Solder joint and trace line failure simulation and experimental validation ..."

Chan-Yen Chou et al. (2008)

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DOI: 10.1016/J.MICROREL.2008.06.024

access: closed

type: Journal Article

metadata version: 2022-10-02

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Chan-Yen Chou, Tuan-Yu Hung, Shin-Yueh Yang, Ming-Chih Yew, Wen-Kun Yang, Kuo-Ning Chiang:
Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact. Microelectron. Reliab. 48(8-9): 1149-1154 (2008)

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