Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Influence of halogen-free compound and lead-free solder paste on on-board ..."

Cho-Liang Chung, Liang-Tien Lu, Yao-Jung Lee (2005)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2005.03.008

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/ChungLL05
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/ChungLL05
Cho-Liang Chung, Liang-Tien Lu, Yao-Jung Lee:
Influence of halogen-free compound and lead-free solder paste on on-board reliability of green CSP (chip scale package). Microelectron. Reliab. 45(12): 1916-1923 (2005)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.