"Influence of halogen-free compound and lead-free solder paste on on-board ..."

Cho-Liang Chung, Liang-Tien Lu, Yao-Jung Lee (2005)

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DOI: 10.1016/J.MICROREL.2005.03.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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Cho-Liang Chung, Liang-Tien Lu, Yao-Jung Lee:
Influence of halogen-free compound and lead-free solder paste on on-board reliability of green CSP (chip scale package). Microelectron. Reliab. 45(12): 1916-1923 (2005)

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