"A multi-scale approach for investigation of interfacial delamination in ..."

Hai Bo Fan, Matthew M. F. Yuen (2010)

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DOI: 10.1016/J.MICROREL.2010.02.029

access: closed

type: Journal Article

metadata version: 2020-02-22

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Hai Bo Fan, Matthew M. F. Yuen:
A multi-scale approach for investigation of interfacial delamination in electronic packages. Microelectron. Reliab. 50(7): 893-899 (2010)

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