"Bondability window and power input for wire bonding."

Lei Han et al. (2006)

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DOI: 10.1016/J.MICROREL.2005.05.018

access: closed

type: Journal Article

metadata version: 2020-02-22

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Lei Han, Fuliang Wang, Wenhu Xu, Jue Zhong:
Bondability window and power input for wire bonding. Microelectron. Reliab. 46(2-4): 610-615 (2006)

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