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"A reliability model for SAC solder covering isothermal mechanical cycling ..."
Dominik Herkommer, Jeff M. Punch, Michael Reid (2010)
- Dominik Herkommer, Jeff M. Punch, Michael Reid:
A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions. Microelectron. Reliab. 50(1): 116-126 (2010)
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