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"Extending the fatigue life of Pb-free SAC solder joints under thermal cycling."

Shoho Ishikawa et al. (2013)

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DOI: 10.1016/J.MICROREL.2013.02.011

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/IshikawaTWNN13
Shoho Ishikawa, Hironori Tohmyoh, Satoshi Watanabe, Tomonori Nishimura, Yoshikatsu Nakano:
Extending the fatigue life of Pb-free SAC solder joints under thermal cycling. Microelectron. Reliab. 53(5): 741-747 (2013)

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