"Effect of moisture swelling on MEMS packaging and integrated sensors."

J. Keller et al. (2013)

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DOI: 10.1016/J.MICROREL.2013.07.107

access: closed

type: Journal Article

metadata version: 2022-10-02

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J. Keller, Raul Mrossko, H. Dobrinski, J. Stürmann, Ralf Döring, Rainer Dudek, Sven Rzepka, Bernd Michel:
Effect of moisture swelling on MEMS packaging and integrated sensors. Microelectron. Reliab. 53(9-11): 1648-1654 (2013)

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