"Highly reliable, fine pitch chip on glass (COG) joints fabricated using ..."

Byeung-Gee Kim et al. (2011)

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DOI: 10.1016/J.MICROREL.2010.11.003

access: closed

type: Journal Article

metadata version: 2020-02-22

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Byeung-Gee Kim, Sang-Mok Lee, Yun-Song Jo, Sun-Chul Kim, Kyoung-Moo Harr, Young-Ho Kim:
Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives. Microelectron. Reliab. 51(4): 851-859 (2011)

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