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"Silver pick up during tail formation in thermosonic wire bonding process."

Jae-sik Lee et al. (2011)

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DOI: 10.1016/J.MICROREL.2010.06.007

access: closed

type: Journal Article

metadata version: 2023-11-13

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Jae-sik Lee, Michael Mayer, Norman Y. Zhou, S. J. Hong, J. T. Moon:
Silver pick up during tail formation in thermosonic wire bonding process. Microelectron. Reliab. 51(1): 38-42 (2011)

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