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"Investigation of the characteristics of overhang bonding for 3-D stacked ..."
Junhui Li et al. (2011)
- Junhui Li, Luhua Deng, Bangke Ma, Ling gang Liu, Fuliang Wang, Lei Han:
Investigation of the characteristics of overhang bonding for 3-D stacked dies in microelectronics packaging. Microelectron. Reliab. 51(12): 2236-2242 (2011)
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