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"Cu diffusion in Ag-plated Cu leadframe packages."

Wu-Hu Li, S. W. Joelle Ong (2012)

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DOI: 10.1016/J.MICROREL.2012.02.022

access: closed

type: Journal Article

metadata version: 2020-02-22

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Wu-Hu Li, S. W. Joelle Ong:
Cu diffusion in Ag-plated Cu leadframe packages. Microelectron. Reliab. 52(7): 1523-1527 (2012)

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