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"Numerical simulations of migration and coalescence behavior of microvoids ..."

Shuibao Liang et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.02.018

access: closed

type: Journal Article

metadata version: 2023-09-30

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Shuibao Liang, Changbo Ke, Wenjing Ma, Minbo Zhou, Xinping Zhang:
Numerical simulations of migration and coalescence behavior of microvoids driven by diffusion and electric field in solder interconnects. Microelectron. Reliab. 71: 71-81 (2017)

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