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"Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal ..."

J. B. Libot et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.02.009

access: closed

type: Journal Article

metadata version: 2020-02-22

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J. B. Libot, Joël Alexis, Olivier Dalverny, L. Arnaud, P. Milesi, F. Dulondel:
Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling. Microelectron. Reliab. 83: 64-76 (2018)

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