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"Surface roughness effect on copper-alumina adhesion."
Ju Dy Lim et al. (2013)
- Ju Dy Lim, Susan Yeow Su Yi, MinWoo Daniel Rhee, Kam Chew Leong, Chee Cheong Wong:
Surface roughness effect on copper-alumina adhesion. Microelectron. Reliab. 53(9-11): 1548-1552 (2013)
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