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"3D Modeling of electromigration combined with thermal-mechanical effect ..."

Yong Liu et al. (2008)

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DOI: 10.1016/J.MICROREL.2008.03.021

access: closed

type: Journal Article

metadata version: 2020-10-26

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Yong Liu, Lihua Liang, Scott Irving, Timwah Luk:
3D Modeling of electromigration combined with thermal-mechanical effect for IC device and package. Microelectron. Reliab. 48(6): 811-824 (2008)

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