"Thermal and mechanical effects of voids within flip chip soldering in LED ..."

Yang Liu et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.07.034

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yang Liu, Stanley Y. Y. Leung, Jia Zhao, Cell K. Y. Wong, Cadmus A. Yuan, Guoqi Zhang, Fenglian Sun, Liangliang Luo:
Thermal and mechanical effects of voids within flip chip soldering in LED packages. Microelectron. Reliab. 54(9-10): 2028-2033 (2014)

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