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"Reliability of Cu wire bonds in microelectronic packages."

Ali Mazloum-Nejadari et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.04.014

access: closed

type: Journal Article

metadata version: 2022-11-25

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  - journals/mr/Mazloum-Nejadari17
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  - https://dblp.org/rec/journals/mr/Mazloum-Nejadari17
Ali Mazloum-Nejadari, Golta Khatibi, Bernhard Czerny, Martin Lederer, Johann Nicolics, L. Weiss:
Reliability of Cu wire bonds in microelectronic packages. Microelectron. Reliab. 74: 147-154 (2017)

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