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"Mechanism of pre-annealing effect on electromigration immunity of Al-Cu line."
M. K. Mazumder et al. (2001)
- M. K. Mazumder, S. Yamamoto, H. Maeda, J. Komori, Y. Mashiko:
Mechanism of pre-annealing effect on electromigration immunity of Al-Cu line. Microelectron. Reliab. 41(8): 1259-1264 (2001)
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