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"Thermal fracture toughness measurement for underfill during temperature ..."

Soojae Park, Claudius Feger (2011)

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DOI: 10.1016/J.MICROREL.2010.10.015

access: closed

type: Journal Article

metadata version: 2020-02-22

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Soojae Park, Claudius Feger:
Thermal fracture toughness measurement for underfill during temperature change. Microelectron. Reliab. 51(3): 685-691 (2011)

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