"Prediction of processing maps for transient liquid phase diffusion bonding ..."

M. S. Park, S. L. Gibbons, Raymundo Arróyave (2014)

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DOI: 10.1016/J.MICROREL.2014.02.023

access: closed

type: Journal Article

metadata version: 2020-08-12

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M. S. Park, S. L. Gibbons, Raymundo Arróyave:
Prediction of processing maps for transient liquid phase diffusion bonding of Cu/Sn/Cu joints in microelectronics packaging. Microelectron. Reliab. 54(6-7): 1401-1411 (2014)

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