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"Module packaging effects on MEMS airbag sensor performance for automobiles."

Dong Hyun Park, Sojin Shin, Yeong K. Kim (2017)

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DOI: 10.1016/J.MICROREL.2017.07.051

access: closed

type: Journal Article

metadata version: 2020-02-22

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Dong Hyun Park, Sojin Shin, Yeong K. Kim:
Module packaging effects on MEMS airbag sensor performance for automobiles. Microelectron. Reliab. 79: 328-335 (2017)

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