"Effect of gas type and flow rate on Cu free air ball formation in ..."

A. Pequegnat et al. (2011)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2010.02.023

access: closed

type: Journal Article

metadata version: 2023-11-13

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/PequegnatKMZPM11
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/PequegnatKMZPM11
A. Pequegnat, H. J. Kim, M. Mayer, Norman Y. Zhou, John Persic, J. T. Moon:
Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding. Microelectron. Reliab. 51(1): 43-52 (2011)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.