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"Role of process parameters on bondability and pad damage indicators in ..."
I. Qin et al. (2011)
- I. Qin, Aashish Shah, C. Huynh, M. Meyer, M. Mayer, Norman Y. Zhou
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Role of process parameters on bondability and pad damage indicators in copper ball bonding. Microelectron. Reliab. 51(1): 60-66 (2011)
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