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"Adhesion energy of printed circuit board materials using ..."
Ronald Schöngrundner et al. (2015)
- Ronald Schöngrundner
, Megan Jo Cordill, Günther A. Maier, Hans-Peter Gänser
:
Adhesion energy of printed circuit board materials using four-point-bending validated with finite element simulations. Microelectron. Reliab. 55(11): 2382-2390 (2015)
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