"Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding."

Aashish Shah et al. (2011)

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DOI: 10.1016/J.MICROREL.2010.06.002

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type: Journal Article

metadata version: 2023-11-13

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Aashish Shah, Alireza Rezvani, M. Mayer, Norman Y. Zhou, John Persic, J. T. Moon:
Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding. Microelectron. Reliab. 51(1): 67-74 (2011)

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