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"Thermal reliability investigation of Ag-Sn TLP bonds for high-temperature ..."
Huakai Shao et al. (2018)
- Huakai Shao, Aiping Wu, Yudian Bao, Yue Zhao, Guisheng Zou, Lei Liu:
Thermal reliability investigation of Ag-Sn TLP bonds for high-temperature power electronics application. Microelectron. Reliab. 91: 38-45 (2018)
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