"Reliability aspects of thermal micro-structures implemented on industrial ..."

L. Y. Sheng et al. (2001)

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DOI: 10.1016/S0026-2714(00)00226-2

access: closed

type: Journal Article

metadata version: 2020-02-22

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L. Y. Sheng, C. De Tandt, Willy Ranson, Roger Vounckx:
Reliability aspects of thermal micro-structures implemented on industrial 0.8 mum CMOS chips. Microelectron. Reliab. 41(2): 307-315 (2001)

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