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"Constitutive modeling on creep deformation for a SnPb-based composite ..."
Yaowu Shi et al. (2010)
- Yaowu Shi, Yanfu Yan, Jianping Liu, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li:
Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particles. Microelectron. Reliab. 50(12): 2020-2025 (2010)
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