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"High-performance FCBGA based on multi-layer thin-substrate packaging ..."
Tadanori Shimoto et al. (2004)
- Tadanori Shimoto, Katsumi Kikuchi, Kazuhiro Baba, Koji Matsui, Hirokazu Honda, Keiichiro Kata:
High-performance FCBGA based on multi-layer thin-substrate packaging technology. Microelectron. Reliab. 44(3): 515-520 (2004)
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