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"Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by ..."

Kyoung-Lim Suk et al. (2012)

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DOI: 10.1016/J.MICROREL.2011.08.003

access: closed

type: Journal Article

metadata version: 2020-02-22

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Kyoung-Lim Suk, Ho-Young Son, Chang-Kyu Chung, Joong Do Kim, Jin-Woo Lee, Kyung-Wook Paik:
Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs). Microelectron. Reliab. 52(1): 225-234 (2012)

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