"Cu-Al intermetallic compound investigation using ex-situ post annealing ..."

Y. Y. Tan et al. (2015)

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DOI: 10.1016/J.MICROREL.2015.06.050

access: closed

type: Journal Article

metadata version: 2025-03-20

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Y. Y. Tan, Q. L. Yang, Kok Swee Sim, Li Tao Sun, Xing Wu:
Cu-Al intermetallic compound investigation using ex-situ post annealing and in-situ annealing. Microelectron. Reliab. 55(11): 2316-2323 (2015)

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